Semiconductor storage device and method for manufacturing semiconductor storage device

ABSTRACT

A semiconductor storage device according to an embodiment includes: a stacked body in which a plurality of conductive layers are stacked via an insulating layer and which has a memory portion in which a plurality of memory cells are disposed and a staircase portion in which end portions of the plurality of conductive layers form a staircase shape. The staircase portion has three or more first sub-staircase portions ascending in a direction opposite to a direction toward the memory portion, and at least one first sub-staircase portion among the three or more first sub-staircase portions is divided into at least an upper staircase and a lower staircase by a difference in level larger than a difference in level of each stair of the first sub-staircase portion.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is based upon and claims the benefit of priority fromJapanese Patent Application No. 2019-158388, filed on Aug. 30, 2019; theentire contents of which are incorporated herein by reference.

FIELD

Embodiments described herein relate generally to a semiconductor storagedevice and a method for manufacturing a semiconductor storage device.

BACKGROUND

In three-dimensional nonvolatile memories, a staircase portion in whichend portions of conductive layers form a staircase shape is provided inorder to lead out the plurality of stacked conductive layers. It isdesired to reduce a staircase length in the staircase portion.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a cross-sectional view illustrating a configuration example ofa semiconductor storage device according to an embodiment;

FIGS. 2A to 2C are cross-sectional views illustrating examples of aprocedure of a method for manufacturing the semiconductor storage deviceaccording to the embodiment;

FIGS. 3A to 3C are cross-sectional views illustrating examples of theprocedure of the method for manufacturing the semiconductor storagedevice according to the embodiment;

FIGS. 4A to 4D are cross-sectional views illustrating examples of theprocedure of the method for manufacturing the semiconductor storagedevice according to the embodiment;

FIGS. 5A and 5B are cross-sectional views illustrating examples of theprocedure of the method for manufacturing the semiconductor storagedevice according to the embodiment;

FIG. 6 is a cross-sectional view illustrating an example of theprocedure of the method for manufacturing the semiconductor storagedevice according to the embodiment;

FIG. 7 is a cross-sectional view illustrating an example of theprocedure of the method for manufacturing the semiconductor storagedevice according to the embodiment;

FIG. 8 is a cross-sectional view illustrating an example of theprocedure of the method for manufacturing the semiconductor storagedevice according to the embodiment;

FIGS. 9A and 9B are cross-sectional views illustrating examples of aprocedure of a method for forming a staircase portion of a semiconductorstorage device according to a first modification of the embodiment;

FIGS. 10A and 10B are cross-sectional views illustrating examples of theprocedure of the method for forming the staircase portion of thesemiconductor storage device according to the first modification of theembodiment;

FIGS. 11A and 11B are cross-sectional views illustrating examples of theprocedure of the method for forming the staircase portion of thesemiconductor storage device according to the first modification of theembodiment;

FIGS. 12A and 12B are cross-sectional views illustrating examples of aprocedure of a method for forming a staircase portion of a semiconductorstorage device according to a second modification of the embodiment;

FIGS. 13A and 13B are cross-sectional views illustrating examples of theprocedure of the method for forming the staircase portion of thesemiconductor storage device according to the second modification of theembodiment; and

FIGS. 14A and 14B are cross-sectional views illustrating examples of theprocedure of the method for forming the staircase portion of thesemiconductor storage device according to the second modification of theembodiment.

DETAILED DESCRIPTION

A semiconductor storage device according to an embodiment includes: astacked body in which a plurality of conductive layers are stacked viaan insulating layer and which has a memory portion in which a pluralityof memory cells are disposed and a staircase portion in which endportions of the plurality of conductive layers form a staircase shape.The staircase portion has three or more first sub-staircase portionsascending in a direction opposite to a direction toward the memoryportion, and at least one first sub-staircase portion among the three ormore first sub-staircase portions is divided into at least an upperstaircase and a lower staircase by a difference in level larger than adifference in level of each stair of the first sub-staircase portion.

Hereinafter, the present invention will be described in detail withreference to the drawings. Incidentally, the present invention is notlimited to the following embodiments. In addition, constituent elementsin the following embodiments include those that can be easily assumed bythose skilled in the art or those that are substantially the same.

(Configuration Example of Semiconductor Storage Device)

FIG. 1 is a cross-sectional view illustrating a configuration example ofa semiconductor storage device 1 according to an embodiment. In thepresent specification, the vertical direction is defined based on ashape of a staircase portion SR to be described below. Specifically, adirection that a terrace portion of the staircase portion SR, that is,an exposed surface of an insulating layer OL in each stair of thestaircase portion SR faces is set as an upward direction.

As illustrated in FIG. 1, the semiconductor storage device 1 includes: amemory portion MEM in which a plurality of memory cells MC are disposedin a three-dimensional manner; the staircase portion SR from which aword line WL which is to be connected to the memory cell MC is led out;and a peripheral circuit CUA which contributes to the operation of thememory cell MC.

The peripheral circuit CUA includes a transistor TR disposed on asubstrate SB such as a silicon substrate, a contact which is connectedto the transistor TR, a wiring, and the like. The entire substrate SBincluding the peripheral circuit CUA is covered by an interlayerinsulating layer LIL. A source line SL is disposed on the interlayerinsulating layer LIL. The source line SL is, for example, a polysiliconlayer.

The stacked body LM in which a plurality of the word lines WL serving asconductive layers and the insulating layers OL are alternately stackedis disposed on the source line SL. The word line WL is, for example, atungsten layer or a molybdenum layer. The insulating layer OL is, forexample, a SiO₂ layer or the like.

Incidentally, the number of the word lines WL included in the stackedbody LM is arbitrary. In addition, the stacked body LM may be configuredby disposing a select gate line (not illustrated) below the word line WLof the lowermost layer or may be configured by disposing a select gateline (not illustrated) above the word line WL of the uppermost layer.

A plurality of pillars PL are disposed in the stacked body LM. Thepillars PL penetrate the stacked body LM in a lamination direction andare disposed in a matrix in the memory portion MEM of the stacked bodyLM.

Each of the pillars PL has a memory layer ME, a channel layer CN, and acore layer CR in this order from an outer circumference side of thepillar PL. The channel layer CN is also disposed at the bottom of thepillar PL. The memory layer ME is, for example, a layer in which a SiO₂layer/a SiN layer/a SiO₂ layer are stacked, the channel layer CN is, forexample, an amorphous silicon layer or a polysilicon layer, and the corelayer CR is, for example, a SiO₂ layer.

The interlayer insulating layer UIL is disposed on the stacked body LM.The channel layer CN of each of the pillars PL is connected to an upperlayer wiring (not illustrated) such as a bit line by a plug CHpenetrating the interlayer insulating layer UIL.

With the above configuration, the plurality of memory cells MC areformed at intersections between the pillars PL and the word lines WL,respectively. When a predetermined voltage is applied via the word lineWL at the same height, data is written to each of the memory cells MC.When a predetermined voltage is applied via the word line WL, data isread from each of the memory cells MC.

The staircase portion SR is disposed in the vicinity of an end portionof the stacked body LM outside the memory portion MEM. The staircaseportion SR is configured by terminating the word line WL and theinsulating layer OL in a staircase shape. The staircase portion SR isentirely covered by the interlayer insulating layer UIL.

The staircase portion SR has staircase portions SRa to SRg assub-staircase portions. The staircase portions SRa to SRg aresequentially disposed from the side close to the memory portion MEM tothe side far from the memory portion MEM. One stair of the staircaseportions SRa to SRg includes one word line WL and one insulating layerOL above this word line WL except for a predetermined stair of thestaircase portion SRd.

The staircase portions SRa, SRc, SRe, and SRg ascend toward the memoryportion MEM. The staircase portion SRa is constituted by a plurality ofupper word lines WL including the uppermost word line WL. The staircaseportion SRc is constituted by a plurality of word lines WL below theword lines WL constituting the staircase portion SRa. The staircaseportion SRe is constituted by a plurality of word lines WL below theword lines WL constituting the staircase portion SRc. The staircaseportion SRg is constituted by a plurality of word lines WL below theword lines WL constituting the staircase portion SRe, the word lines WLincluding the lowermost word line WL.

Contacts CC are disposed at stairs of the staircase portions SRa, SRc,SRe, and SRg, respectively. Each of the contacts CC penetrates theinsulating layer OL constituting a terrace portion of the stair wherethe corresponding contact CC is disposed, and is connected to the lowerword line WL. The contact CC extends through the interlayer insulatinglayer UIL, and an upper end thereof is connected to, for example, anupper wiring (not illustrated) that receives a signal from theperipheral circuit CUA.

With the above configuration, all the word lines WL included in thestacked body LM are led out in a staircase form and connected to theupper wiring via the contacts CC. In this manner, the staircase portionsSRa, SRc, SRe, and SRg are constituted by the word lines WL connected tothe contacts CC and the memory cells MC. The staircase portions SRa,SRc, SRe, and SRg are sometimes referred to as real staircases.

The staircase portions SRb and SRf ascend in a direction opposite to thememory portion MEM. The staircase portion SRb is constituted by wordlines WL in the same levels as the word lines WL constituting thestaircase portion SRa, and opposes the staircase portion SRa with alanding portion LDa interposed therebetween. The staircase portion SRfis constituted by word lines WL in the same levels as the word lines WLconstituting the staircase portion SRe, and opposes the staircaseportion SRe with a landing portion LDe interposed therebetween.

The staircase portion SRd ascends in the direction opposite to thememory portion MEM. The staircase portion SRd includes a plurality ofstairs each of which is constituted by a pair of the word line WL andthe insulating layer OL. In addition, the staircase portion SRd has atleast one stair constituted by a plurality of the word lines WL and aplurality of the insulating layers OL. Therefore, this stair has adifference in level SRdc larger than a difference in level of each ofthe other stairs.

The staircase portion SRd includes an upper staircase SRdu and a lowerstaircase SRdl divided by the difference in level SRdc. In addition, thestaircase portion SRd includes a protruding portion EX constituted bythe difference in level SRdc and the upper staircase SRdu. A top portionTP of the protruding portion EX has a difference in level generated bythe upper staircase SRdu.

The staircase portion SRd is constituted by the word lines WL in thesame levels as the word lines WL constituting the staircase portions SRaand SRc, and at least the lower staircase SRdl of the staircase portionSRd opposes the staircase portion SRc with a landing portion LDcinterposed therebetween.

The word lines WL constituting the staircase portions SRb, SRd, and SRfare separated from the memory cells MC. The word lines WL constitutingthe staircase portions SRb, SRd, and SRf are in an electrically floatingstate, and the staircase portions SRb, SRd, and SRf are invalid regionsthat do not contribute to the function of the semiconductor storagedevice 1. The staircase portions SRb, SRd, and SRf are sometimesreferred to as dummy staircases.

(Method for Manufacturing Semiconductor Storage Device)

Next, an example of a method for manufacturing the semiconductor storagedevice 1 according to the embodiment will be described with reference toFIGS. 2A to 8. FIGS. 2A to 8 are cross-sectional views illustratingexamples of a procedure of the method for manufacturing thesemiconductor storage device 1 according to the embodiment.

As illustrated in FIG. 2A, the peripheral circuit CUA including thetransistor TR and the like is formed on the substrate SB such as asilicon substrate. The peripheral circuit CUA is covered by theinterlayer insulating layer LIL.

As illustrated in FIG. 2B, the source line SL is formed on theinterlayer insulating layer LIL.

As illustrated in FIG. 2C, a stacked body LMs in which a plurality ofsacrificial layers NL serving as a plurality of insulating layers and aplurality of insulating layers OL are alternately stacked is formed onthe source line SL. The sacrificial layer ND is, for example, a SiNlayer or the like, and is a layer that can be replaced with the wordline WL later.

A staircase portion SR is formed in the vicinity of an end portion ofthe stacked body LMs. A method for forming the staircase portion SR willbe described later.

As illustrated in FIG. 3A, a plurality of memory holes MH whichpenetrate through the stacked body LMs and reach the source line SL areformed.

As illustrated in FIG. 3B, the memory layer ME is stacked on an innerwall of each of the memory holes MH. More specifically, a blockinsulating layer BK such as a SiO₂ layer, a charge storage layer CT suchas a SiN layer, and a tunnel insulating layer TN such as a SiO₂ layerare formed from the inner wall side of the memory hole MH. The blockinsulating layer BK, the charge storage layer CT, and the tunnelinsulating layer TN constitute the memory layer ME.

As illustrated in FIG. 3C, the channel layer CN is formed on an innerwall of the tunnel insulating layer TN. The channel layer CN is alsoformed at the bottom of the memory hole MH. A hollow on the inner sideof the channel layer CN is filled with the core layer CR. As a result,the pillar PL is formed.

Next, the method for forming the staircase portion SR will be described.Incidentally, FIGS. 4A to 5B do not illustrate a lower structureincluding a part of the stacked body LMs.

As illustrated in FIG. 4A, a plurality of island-like mask patterns MKaare formed on the stacked body LMs. The mask pattern MKa is, forexample, a resist pattern made of a photosensitive resin.

As illustrated in FIG. 4B, slimming is performed with O₂ plasma or thelike such that a width of the mask pattern MKa is gradually narrowed. Inaddition, a pair of the insulating layer OL and the sacrificial layer NLis removed from an upper layer to a lower layer of the stacked body LMseach time the mask pattern MKa is slimmed. As a result, a staircase-likeshape is formed from a skirt portion of the mask pattern MKa toward alower layer of the stacked body LMs. That is, staircase portions SRas toSRgs in the middle of processing are formed.

These staircase portions SRas to SRgs are all positioned at the samelevel in the stacked body LMs, and the staircase portions SRas and SRbs,the staircase portions SRcs and SRds, and the staircase portions SResand SRfs oppose each other with landing portions LDas, LDcs, and LDesinterposed therebetween, respectively.

Next, lowering step by multi-stage processing is performed such thatthese staircase portions SRas to SRgs are positioned at differentlevels.

As illustrated in FIG. 4C, a plurality of island-like mask patterns MKbare formed on the stacked body LMs. The mask pattern MKb is, forexample, a resist pattern made of a photosensitive resin.

One island of the mask pattern MKb is formed so as to cover thestaircase portions SRas and SRbs and the landing portion LDas. One endportion of the mask pattern MKb is disposed in a flat portion FTbsbetween the staircase portions SRbs and SRcs.

Another island of the mask pattern MKb is formed so as to cover a partof the staircase portion SRds, the staircase portions SRes and SRfs, andthe landing portion LDes. One end portion of the mask pattern MKb isdisposed in a flat portion FTfs between the staircase portions SRfs andSRgs. The other end portion of the mask pattern MKb covers a flatportion FTds between the staircase portions SRds and SRes, and isdisposed in the middle of the staircase portion SRds.

As illustrated in FIG. 4D, the exposed staircase portions SRcs, SRds,and SRgs and the landing portion LDcs are dug down using the maskpattern MKb as a mask while maintaining the staircase shape. As aresult, the staircase portions SRcs, SRds, and SRgs are constituted bythe insulating layers OL and the sacrificial layers NL which are lowerthan the insulating layers OL and the sacrificial layers NL constitutingthe staircase portions SRas, SRbs, SRes, and SRfs.

At this time, the flat portions FTbs and FTfs are partially scraped andbelong to the lower staircase portions SRcs and SRgs, respectively.

In addition, lower stairs of the staircase portion SRds are scraped atthis time, and the staircase portion SRds has a difference in levelSRdcs and an upper staircase SRdus and a lower staircase SRdls dividedby the difference in level SRdcs. The flat portion FTds is protected bythe mask pattern MKb and remains as it is.

As illustrated in FIGS. 4C and 4D, processing a large number of stairsat once to position the staircase portions SRcs, SRds, and SRgs in lowerlayers is sometimes referred to as lowering step by multi-stageprocessing.

As illustrated in FIG. 5A, a mask pattern MKc is formed. The maskpattern MKc is, for example, a resist pattern made of a photosensitiveresin.

The mask pattern MKc covers the staircase portions SRas to SRds andlanding portions LDas and LDcs. One end portion of the mask pattern MKcis disposed in the flat portion FTds between the staircase portions SRdsand SRes.

As illustrated in FIG. 5B, the exposed staircase portions SRes to SRgsand landing portions LDes are lowered by multi-stage processing usingthe mask pattern MKc as a mask while maintaining the staircase shape. Asa result, the staircase portions SRes to SRgs are constituted by theinsulating layers OL and the sacrificial layers NL which are lower thanthe insulating layers OL and the sacrificial layers NL constituting thestaircase portions SRas to SRds.

At this time, the flat portion FTds is partially scraped and belongs tothe lower staircase portion SRes. As a result, a protruding portion EXshaving a top portion TPs is formed in the staircase portion SRds. Thetop portion TPs of the protruding portion EXs has a difference in levelgenerated by the upper staircase SRdus of the staircase portion SRds.

As above, the formation of the staircase portions SRas to SRgs isterminated. As described above, the staircase portions SRas to SRgsbelonging to different levels, respectively, are formed by performingthe lowering step by multi-stage processing twice.

As illustrated in FIG. 6, the interlayer insulating layer UIL thatcovers the entire stacked body LMs including the staircase portions SRasto SRgs is formed after the pillar PL is formed as described above. Inaddition, a slit (not illustrated) is formed. The slit has agroove-shaped configuration that penetrates the stacked body LMs alongthe cross-sectional direction of FIG. 6.

As illustrated in FIG. 7, the sacrificial layer NL of the stacked bodyLMs is removed through the slit. As a result, a stacked body LMg havinggaps between the insulating layers OL is formed. In addition, at thistime, staircase portions SRag to SRgg including gaps, landing portionsLDag, LDcg, and LDeg, and a protruding portion EXg including gaps areformed.

As illustrated in FIG. 8, the gaps of the stacked body LMg are filledwith a conductive material such as tungsten and molybdenum through theslit to form the word line WL. As a result, the stacked body LM havingthe staircase portions SRa to SRg, the landing portions LDa, LDc, andLDe, and the protruding portion EX are formed.

Incidentally, the process of replacing the sacrificial layer NL with theword line WL as illustrated in FIGS. 7 and 8 is sometimes referred to asreplacement.

Thereafter, the plug CH is connected to the pillar PL, the contacts CCare connected to the staircase portions SRa to SRg, and further, theupper wiring thereof is formed.

As described above, the semiconductor storage device 1 of the embodimentis manufactured.

In a method for manufacturing a semiconductor storage device such as athree-dimensional nonvolatile memory, a staircase structure is generallyformed so as to lead out word lines stacked in multiple layers. At thistime, a technique of adding a difference in level in order from theuppermost layer to the lowermost layer at an end portion of a stackedbody requires a large number of steps so that a manufacturing load ishigh. Therefore, a technique is conceivable in which a plurality ofsub-staircase portions are formed on the same level and thesub-staircase portions are processed to belong to different levels usingthe lowering step by multi-stage processing.

When the lowering step is performed, a flat portion between thesub-staircase portions is used to secure a margin for lithography of amask pattern and subsequent etching. For example, in a method formanufacturing a semiconductor storage device according to a comparativeexample, alignment is performed such that an end portion of a maskpattern is disposed in flat portions between sub-staircase portionsduring twice lowering steps. The end portion of the mask pattern isdisposed on a flat portion, which is to be a top portion of a protrudingportion later, out of the flat portions over the twice lowering steps.In this case, the flat portion is formed to be wide such that a marginfor the twice lowering steps can be sufficiently obtained, a staircaselength of the entire staircase portion tends to be long.

Incidentally, the protruding portion is also formed in the method formanufacturing the semiconductor storage device according to thecomparative example, the sub-staircase portion having the protrudingportion is not divided, and the top portion of the protruding portionhas no difference in level.

According to the semiconductor storage device 1 of the embodiment, theend portion of the mask pattern MKb is not disposed in the flat portionFTds between the staircase portions SRds and SRes in the first loweringstep between the twice lowering steps. Instead, the staircase portionSRds, which is the dummy staircase, is used for lithography alignment.As a result, it is sufficient for the flat portion FTds to have a widththat allows a margin to be obtained in one-time lithography and etchingusing the mask pattern MKc, and the flat portion FTds can be designed tobe narrow. Accordingly, the staircase length of the entire staircaseportion SR can be reduced.

(First Modification)

The above configuration can be applied even when the number ofsub-staircase portions is increased. A method for forming staircaseportions SRax to SRkx of a semiconductor storage device according to afirst modification of the embodiment will be described with reference toFIGS. 9A to 11B. FIGS. 9A to 11B are cross-sectional views illustratingexamples of a procedure of the method for forming the staircase portionsSRax to SRkx of the semiconductor storage device according to the firstmodification of the embodiment.

As illustrated in FIG. 9A, the staircase portions SRax to SRkx areformed at the same level position in a stacked body LMx by theprocessing corresponding to FIGS. 4A and 4B of the above-describedembodiment. Island-like mask patterns MKbx is formed on the stacked bodyLMx.

One end portions of the island-shaped mask patterns MKbx are disposedrespectively in flat portions FTbx, FTfx, and FTjx among thepredetermined staircase portions SRax to SRkx. The other end portions ofthe mask patterns MKbx are disposed in the middle of the staircaseportions SRdx and SRhx so as to cover the flat portions FTdx and FThx,respectively.

As illustrated in FIG. 9B, exposed staircase portions SRcx, SRgx, SRkxare lowered to a lower level position by multi-stage processing usingthe mask pattern MKbx as a mask. In addition, lower layer portions ofthe staircase portions SRdx and SRhx are also lowered, and each of thestaircase portions SRdx and SRhx is divided into two parts.

As illustrated in FIG. 10A, a mask pattern MKcx is formed. One endportion of the mask pattern MKcx is disposed in a flat portion FTdxbetween the staircase portions SRdx and SRex.

As illustrated in FIG. 10B, the exposed staircase portions SRex to SRkxare lowered to a lower level position by multi-stage processing usingthe mask pattern MKcx as a mask. As a result, a protruding portion EXdxhaving a top portion TPdx with a difference in level is formed in thestaircase portion SRdx.

As illustrated in FIG. 11A, a mask pattern MKdx is formed. One endportion of the mask pattern MKdx is disposed in the flat portion FThxbetween the staircase portions SRhx and SRix.

As illustrated in FIG. 11B, the exposed staircase portions SRix to SRkxare lowered to a lower level position by multi-stage processing usingthe mask pattern MKdx as a mask. As a result, a protruding portion EXhxhaving a top portion TPhx with a difference in level is formed in thestaircase portion SRhx.

As above, the formation of the staircase portions SRax to SRkx isterminated. As described above, the staircase portions SRax to SRkxbelonging to different levels, respectively, are formed by performingthe lowering step by multi-stage processing three times. In addition,the staircase portions SRdx and SRhx which are divided into two partsand have the protruding portions EXdx and EXhx, respectively, areformed.

In the method for forming the staircase portions SRax to SRkx, the flatportion FTdx can be used for the alignment of the mask patterns MKbx andMKcx twice out of the three times of lowering steps. However, the flatportion FTdx can be designed to be narrow by aligning the mask patternMKbx once using the staircase portion SRdx.

In addition, in the method for forming the staircase portions SRax toSRkx, the flat portion FThx can be used for the alignment of the maskpatterns MKbx and MKdx twice out of the three times of lowering steps.However, the flat portion FThx can be designed to be narrow by aligningthe mask pattern MKbx once using the staircase portion SRhx.

(Second Modification)

In the above-described embodiment and first modification, two realstaircases are grouped as one set, one of the two real staircases islowered, and then, two real staircases belonging to the same set arelowered together.

That is, in the embodiment, the staircase portions SRas to SRgs aregrouped into a set of the staircase portions SRas and SRcs and a set ofthe staircase portions SRes and SRgs, the staircase portions SRcs andSRgs, each of which is one of the set, are lowered, and then, the twostaircase portions SRes and SRgs belonging to the same set are loweredtogether.

In addition, in the first modification, the staircase portions SRax toSRkx are grouped into a set of the staircase portions SRax and SRcx, aset of the staircase portions SRex and SRgx, and a set of the staircaseportions SRix and SRkx, the staircase portions SRcx, SRgx, and SRkx,each of which is one of the set, are lowered, and then, the staircaseportions SRex and SRgx belonging to the same set and the staircaseportions SRix and SRkx belonging to the same set are lowered together,and further, the staircase portions SRix and SRkx belonging to the sameset are lowered.

In the second modification of the embodiment, three real staircases aregrouped as one set, the lowering is sequentially performed within theset, and then, the three real staircases belonging to the same set arelowered together.

A method for forming staircase portions SRay to SRky of a semiconductorstorage device according to the second modification of the embodimentwill be described with reference to FIGS. 12A to 14B. FIGS. 12A to 14Bare cross-sectional views illustrating examples of a procedure of themethod for forming the staircase portions SRay to SRky of thesemiconductor storage device according to the second modification of theembodiment.

As illustrated in FIG. 12A, the staircase portions SRay to SRky areformed at the same level position in a stacked body LMy by theprocessing corresponding to FIGS. 4A and 4B of the above-describedembodiment. Island-like mask patterns MKby is formed on the stacked bodyLMy.

One end portions of the mask patterns MKby are disposed respectively inflat portions FTdy and FTjy among the predetermined staircase portionsSRay to SRky. The other end portion of the mask pattern MKby is disposedin the middle of the staircase portion SRfy.

As illustrated in FIG. 12B, the exposed staircase portions SRey and SRkyare lowered to a lower level position by multi-stage processing usingthe mask pattern MKby as a mask. In addition, lower layer portions ofthe staircase portion SRfy are lowered, and the staircase portion SRfyis divided into two parts.

As illustrated in FIG. 13A, island-shaped mask patterns MKcy are formed.One end portions of the mask patterns MKcy are disposed in a flatportion FTby between the staircase portions SRby and SRcy and a flatportion FThy between the staircase portions SRhy and SRiy. The other endportion of the mask pattern MKcy is disposed in the middle of thestaircase portion SRfy.

As illustrated in FIG. 13B, the exposed staircase portions SRcy to SReyand SRiy to SRky are further lowered to a lower level position bymulti-stage processing using the mask pattern MKcy as a mask. Inaddition, a part of a lower staircase of the staircase portion SRfydivided into two parts is further lowered, and the staircase portionSRfy is divided into three parts. That is, the staircase portion SRfyhas three staircases of a lower staircase, a middle staircase, and anupper staircase.

As illustrated in FIG. 14A, a mask pattern MKdy is formed. One endportion of the mask pattern MKdy is disposed in a flat portion FTfybetween the staircase portions SRfy and SRgy.

As illustrated in FIG. 14B, the exposed staircase portions SRgy to SRkyare lowered to a lower level position by multi-stage processing usingthe mask pattern MKdy as a mask. As a result, a protruding portion EXfyhaving a top portion TPfy with a difference in level is formed in thestaircase portion SRfy.

As above, the formation of the staircase portions SRay to SRky isterminated. As described above, the staircase portions SRay to SRkybelonging to different levels, respectively, are formed by performingthe lowering step by multi-stage processing three times. In addition,the staircase portion SRfy divided into three parts and having theprotruding portion EXfy is formed.

In the method for forming the staircase portions SRay to SRky, the flatportion FTfy can be used for the alignment of the mask patterns MKby toMKdy three times during the three times of lowering steps. However, theflat portion FTfy can be designed to be narrow by aligning the maskpatterns MKby and MKcy twice using the staircase portion SRfy.

As described above, the number of protruding portions and the number ofdivisions of sub-staircase portions having the protruding portions varydepending on the number of sub-staircase portions and the lowering steptechnique. That is, the number of protruding portions and the number ofdivisions of sub-staircase portions are arbitrary regardless of theexamples of the embodiment and the first and second modifications.

Incidentally, the peripheral circuit CUA is disposed below the memoryportion MEM in the semiconductor storage devices according to theabove-described embodiment and first and second modifications, but theinvention is not limited thereto. The memory portion and the staircaseportion may be disposed immediately above the substrate, and theperipheral circuit may be disposed outside the memory portion and thestaircase portion. Alternatively, a peripheral circuit may be disposedabove the memory portion and the staircase portion.

While certain embodiments have been described, these embodiments havebeen presented by way of example only, and are not intended to limit thescope of the inventions. Indeed, the novel embodiments described hereinmay be embodied in a variety of other forms; furthermore, variousomissions, substitutions and changes in the form of the embodimentsdescribed herein may be made without departing from the spirit of theinventions. The accompanying claims and their equivalents are intendedto cover such forms or modifications as would fall within the scope andspirit of the inventions.

What is claimed is:
 1. A semiconductor storage device comprising astacked body in which a plurality of conductive layers are stacked viaan insulating layer, the stacked body having a memory portion in which aplurality of memory cells are disposed and a staircase portion in whichend portions of the plurality of conductive layers form a staircaseshape, wherein the staircase portion has three or more firstsub-staircase portions ascending in a direction opposite to a directiontoward the memory portion, and at least one first sub-staircase portionamong the three or more first sub-staircase portions is divided into atleast an upper staircase and a lower staircase by a difference in levellarger than a difference in level of each stair of the firstsub-staircase portion.
 2. The semiconductor storage device according toclaim 1, wherein each stair of the first sub-staircase portion has asame number of a layer or layers of the conductive layers, and thedifference in level that divides the first sub-staircase portionincludes more layers of the conductive layers than each stair of thefirst sub-staircase portion.
 3. The semiconductor storage deviceaccording to claim 1, wherein second sub-staircase portions ascending ina direction toward the memory portion are disposed one by one among thethree or more first sub-staircase portions.
 4. The semiconductor storagedevice according to claim 3, wherein the second sub-staircase portionsbelong to different levels.
 5. The semiconductor storage deviceaccording to claim 3, wherein a contact connected to a correspondinglayer of the conductive layers constituting the second sub-staircaseportion is disposed in the second sub-staircase portion.
 6. Thesemiconductor storage device according to claim 3, wherein theconductive layers constituting the second sub-staircase portion areconnected to the memory cells.
 7. The semiconductor storage deviceaccording to claim 1, wherein the conductive layers constituting thethree or more first sub-staircase portions are not connected to thememory cells.
 8. The semiconductor storage device according to claim 1,wherein the lower staircase of the first sub-staircase portion dividedby the difference in level belongs to a different level from the otherfirst sub-staircase portions.
 9. The semiconductor storage deviceaccording to claim 1, wherein a number of the first sub-staircaseportions provided in the staircase portion is five or more, and at leasttwo first sub-staircase portions among the five or more firstsub-staircase portions are divided into at least two parts by thedifference in level dividing the first sub-staircase portion.
 10. Thesemiconductor storage device according to claim 1, wherein a number ofthe first sub-staircase portions provided in the staircase portion isfive or more, and at least one first sub-staircase portion among thefive or more first sub-staircase portions is divided into at least threeparts by two or more of the difference in level dividing the firstsub-staircase portion.
 11. A semiconductor storage device comprising astacked body in which a plurality of conductive layers are stacked viaan insulating layer, the stacked body having a memory portion in which aplurality of memory cells are disposed and a staircase portion in whichend portions of the plurality of conductive layers form a staircaseshape, wherein the staircase portion comprises: a first staircaseportion ascending in a first direction toward the memory portion; and asecond staircase portion adjacent to the first staircase portion on thefirst direction side and ascending in a second direction opposite to thefirst direction, the second staircase portion being formed with aprotruding portion on the first staircase portion side, and a topportion of the protruding portion having a difference in level.
 12. Thesemiconductor storage device according to claim 11, wherein thedifference in level of the top portion faces the first direction. 13.The semiconductor storage device according to claim 12, wherein thesecond staircase portion also has a difference in level facing the firstdirection in middle of the protruding portion.
 14. The semiconductorstorage device according to claim 11, wherein the first staircaseportion and the second staircase portion belong to different layers. 15.The semiconductor storage device according to claim 11, wherein thefirst staircase portion belongs to a lower level than the secondstaircase portion.
 16. The semiconductor storage device according toclaim 11, wherein a contact connected to a corresponding layer of theconductive layers constituting the first staircase portion is disposedin the first staircase portion.
 17. The semiconductor storage deviceaccording to claim 11, wherein the conductive layers constituting thefirst staircase portion are connected to the memory cells.
 18. Thesemiconductor storage device according to claim 11, wherein theconductive layers constituting the second staircase portion are notconnected to the memory cells.
 19. A method for manufacturing asemiconductor storage device comprising: forming a stacked body in whicha plurality of first layers are stacked via a second layer; slimming afirst mask pattern disposed on the stacked body and forming a firststaircase portion ascending in a first direction and a second staircaseportion adjacent to the first staircase portion on the first directionside and ascending in a second direction opposite to the firstdirection; and lowering the second staircase portion in part whilecovering the entire first staircase portion, an entire flat portionbetween the first staircase portion and the second staircase portion,and a part of the second staircase portion with a second mask patternand lowering the first staircase portion while covering the entiresecond staircase portion and a part of the flat portion with a thirdmask pattern so as to position the first staircase portion and thesecond staircase portion in different layers, lowering the secondstaircase portion in part including forming a protruding portion of thesecond staircase portion having a difference in level at a top portionon the first staircase portion side of the second staircase portion. 20.The method for manufacturing a semiconductor storage device according toclaim 19, wherein after lowering the second staircase portion in partwith the second mask pattern as a mask and before lowering the firststaircase portion with the third mask pattern as a mask, the secondstaircase portion is further lowered in part while covering the entirefirst staircase portion, the entire flat portion, and a part of thesecond staircase portion with a fourth mask pattern having a differentpattern from the second mask pattern.